APPLICATIONS Orientation processes Flat & notch on "as grown" ingots Flat & notch on ground ingots (cylindrical) Orientation measurements Ingot flat Ingot notch Seed axis (round or square seeds) Wafer face Wafer flat VERSIONS & CONFIGURATIONS Capacities From diameter 2 inches up to 12 inches and 800 mm in length. Dual stations with mixed versions Many dedicated holders.
The GM SI Series X-ray orientation systems are heavy duty production units especially designed for locating the flat or notch position on all kinds of single crystal, from the smallest to the largest size. All single crystal can be processed, for all applications suc as semi conductors, opto electronics, optics, etc... GMSI are specifically designed for operation in combination with grinding equipment where ingot is hold between centers.
RANGE OF OPERATIONS Goniometer /rotation range : -10° to 110°, with fast/ coarse and slow/fine rotation range detector. PERFORMANCE X ray detection : +/- 0,01° Orientation process : +/- 0,03 to 0,05° depending of configuration and crystals. Measurement accuracy : +/- 0,01° to 0,03° X-Ray generator Out put voltage : 30 kV-DC Max. rating : 30mA
INGOT ORIENTATION PRIOR TO FLAT & NOTCH GRINDING
GM SI Series X-Ray Goniometers
Ingot flat orientation before grinding.
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